www.gsilumonics.com
Their
lasers are offered to manufacturers and industrial integrators
as industrial process tools, and to OEMs for integration to a
variety of systems.
With corporate offices in Billerica, MA, GSI Group develops and delivers the enabling technology solutions that bring our customers' advanced manufacturing applications to life.
Our leading brands include precision motion products, lasers, and laser systems, and are used to boost efficiency annd productivity in the global medical, semiconductor, electronics, and industrial markets.
GSI Group's common shares are listed on Nasdaq (GSIG) and The Toronto Stock Exchange (GSI).
CircuitTrim™ systems provide cost effective adjustment and customization
If you are manufacturing components, RF modules, or other microelectronic devices on ceramic, PCB, flex, silicon, glass, and metal, the GSI Group CircuitTrim series provides the most cost-effective laser trim solutions.
With our proprietary laser processes, we cover all trim applications including the latest requirements for embedded passive trim and wireless/RF active trim.
Our unique TrimPulse™ control software adjusts laser pulse width at variable Q-rates to optimize throughput with no compromise in trim quality. Our patented beam calibration and alignment technology achieves the positioning accuracies required for continued device miniaturization.
CircuitTrim laser trim systems are production proven by a broad base of microelectronics industry leaders. With over 2000 systems installed, our family of adaptable platforms enables us to quickly tailor solutions that meet your diverse and unique requirements.
WaferMark
WaferMark® series laser systems from GSI Group are the recognized industry leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification.
GSI Group invented wafer marking processes over 25 years ago and continually innovate solutions for new substrate materials, larger wafer diameters, wafer-level die marking and factory automation.
The world’s silicon suppliers, wafer reclaim, and semiconductor manufacturers consistently come to us for unsurpassed mark quality with our hardmark and patented SuperSoftMark® processes.
We continue this tradition of innovation and leadership with our new-generation die marking system, the WaferMark CSP200 . Designed for the emerging requirements of DCA applications, our latest system incorporates integrated mark verification and laser positioning accuracies required for continued device miniaturization.
WaferMark® Wafer and Die Marking
WaferMark® series laser systems from GSI Group are the recognized industry leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification.
GSI Group invented wafer marking processes over 25 years ago and continually innovate solutions for new substrate materials, larger wafer diameters, wafer-level die marking and factory automation.
The world’s silicon suppliers, wafer reclaim, and semiconductor manufacturers consistently come to us for unsurpassed mark quality with our hardmark and patented SuperSoftMark® processes.
We continue this tradition of innovation and leadership with our new-generation die marking system, the WaferMark CSP200 . Designed for the emerging requirements of DCA applications, our latest system incorporates integrated mark verification and laser positioning accuracies required for continued device miniaturization.
